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MX7845KP+

MX7845KP+

MX7845KP+

Maxim Integrated

DAC Voltage 1.5 B B

SOT-23

MX7845KP+ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case LCC
Number of Pins 28
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 28
Terminal Finish Matte Tin (Sn)
Max Operating Temperature70°C
Min Operating Temperature 0°C
Subcategory Other Converters
Technology BICMOS
Terminal Position QUAD
Terminal FormJ BEND
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 15V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count28
Qualification StatusNot Qualified
Output Type Voltage
Temperature GradeCOMMERCIAL
Interface Parallel
Number of Bits 12
Converter Type D/A CONVERTER
Supply Type Dual
Resolution 1.5 B
Settling Time2.5 μs
Integral Nonlinearity (INL) 0.75 LSB
Input Bit Code BINARY
Number of Converters 1
Negative Supply Voltage-Nom -15V
Height Seated (Max) 4.572mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2228 items

MX7845KP+ Product Details

MX7845KP+ Overview


In the LCC package, you will find it. In order to operate it, a voltage supply of 15V volts is required. FPGA parts like this belong to the Other Converters family. 28 terminations are present in total. In order to make it work, 28 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. As a result of the design of this module, the maximum operating temperature reaches 70°C. There should be a temperature difference between 0°C and the operating temperature. With a total of 28 pins, it is equipped with a high level of security.

MX7845KP+ Features


LCC package
28 pin count
28 pins


MX7845KP+ Applications


There are a lot of Maxim Integrated
MX7845KP+ Digital to Analog Converters (DAC) applications.


  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point

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