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MX7535SQ

MX7535SQ

MX7535SQ

Maxim Integrated

DAC 1.75 B B 15.24mm mm

SOT-23

MX7535SQ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case CDIP
Surface MountNO
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code8542.39.00.01
Subcategory Other Converters
Technology CMOS
Terminal Position DUAL
Terminal FormTHROUGH-HOLE
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Terminal Pitch2.54mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count28
JESD-30 Code R-GDIP-T28
Qualification StatusNot Qualified
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Power Supplies12/15GND/-0.3V
Temperature GradeMILITARY
Number of Bits 14
Supply Current-Max 4mA
Converter Type D/A CONVERTER
Resolution 1.75 B
Settling Time0.8 µs
Linearity Error-Max (EL) 0.0122%
Input Bit Code BINARY, OFFSET BINARY
Input Format PARALLEL, WORD
Analog Output Voltage-Max 10V
Analog Output Voltage-Min -10V
Settling Time-Max 1.5μs
Height Seated (Max) 5.89mm
Width 15.24mm
RoHS StatusRoHS Compliant
In-Stock:4558 items

MX7535SQ Product Details

MX7535SQ Overview


The package that contains this software is called CDIP. Part of the Other Converters family, this FPGA part is a programmable gate array. In total, it has a total of 28 terminations. In order for it to work, it requires a 12/15GND/-0.3V power supply. A total of 28 pins are included in this device. Temperatures should not exceed 125°C degrees Celsius at any time during operation. A temperature of at least -55°C should be used as the operating temperature.

MX7535SQ Features


CDIP package
28 pin count


MX7535SQ Applications


There are a lot of Maxim Integrated
MX7535SQ Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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