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MX7533LEWE+

MX7533LEWE+

MX7533LEWE+

Maxim Integrated

DAC 1.25 B B

SOT-23

MX7533LEWE+ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 16
PackagingBulk
Pbfree Code yes
Max Operating Temperature85°C
Min Operating Temperature -40°C
Pin Count16
Interface Parallel
Max Supply Voltage16.5V
Min Supply Voltage5V
Power Dissipation-Max 450mW
Number of Bits 10
Supply Type Single
Resolution 1.25 B
Settling Time600 ns
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:3848 items

MX7533LEWE+ Product Details

MX7533LEWE+ Overview


A SOIC package is provided with this component. It is for space saving reasons that this FPGA model is contained in Bulk. 16 pins are designed into the device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. Operating temperatures should exceed -40°C. In addition to this, it has 16 pins. A maximum voltage of 16.5V can be supplied to it. As long as the supply voltage is at least 5V, it is able to work properly.

MX7533LEWE+ Features


SOIC package
16 pin count
16 pins


MX7533LEWE+ Applications


There are a lot of Maxim Integrated
MX7533LEWE+ Digital to Analog Converters (DAC) applications.


  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications

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