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MX7524KEPE+

MX7524KEPE+

MX7524KEPE+

Maxim Integrated

DAC 1 B B 7.62mm mm

SOT-23

MX7524KEPE+ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 16
Terminal Finish Matte Tin (Sn)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Subcategory Other Converters
Technology CMOS
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 5V
Terminal Pitch2.54mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count16
Qualification StatusNot Qualified
Temperature GradeOTHER
Interface Parallel
Max Supply Voltage15V
Min Supply Voltage5V
Power Dissipation-Max 450mW
Number of Bits 8
Supply Current-Max 2mA
Converter Type D/A CONVERTER
Supply Type Single
Resolution 1 B
Settling Time400 ns
Integral Nonlinearity (INL) 0.5 LSB
Input Bit Code BINARY, OFFSET BINARY
Number of Converters 1
Height Seated (Max) 4.572mm
Width 7.62mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2824 items

MX7524KEPE+ Product Details

MX7524KEPE+ Overview


In the DIP package, you will find it. In order to operate it, a voltage supply of 5V volts is required. FPGA parts like this belong to the Other Converters family. 16 terminations are present in total. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Through Hole. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between -40°C and the operating temperature. With a total of 16 pins, it is equipped with a high level of security. It can accept a maximum voltage of 15V volts as a supply voltage. A minimal supply voltage of 5V is required for it to operate.

MX7524KEPE+ Features


DIP package
16 pin count


MX7524KEPE+ Applications


There are a lot of Maxim Integrated
MX7524KEPE+ Digital to Analog Converters (DAC) applications.


  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point

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