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MAX6732AUTVDD3+

MAX6732AUTVDD3+

MAX6732AUTVDD3+

Maxim Integrated

6 Terminals Voltage supervisor Min 800mV Max 5.5V

SOT-23

MAX6732AUTVDD3+ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SOT-23
Number of Pins 6
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Operating Temperature125°C
Min Operating Temperature -40°C
HTS Code8542.39.00.01
Subcategory Power Management Circuits
Technology BICMOS
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 225
Terminal Pitch0.95mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification StatusNot Qualified
Power Supplies1/5V
Temperature GradeAUTOMOTIVE
Max Supply Voltage5.5V
Min Supply Voltage800mV
Power Dissipation-Max 696mW
Watchdog TimerYes
Supply Current-Max (Isup) 0.039mA
RoHS StatusRoHS Compliant
In-Stock:1488 items

MAX6732AUTVDD3+ Product Details

MAX6732AUTVDD3+ Overview


This power management consists of 6 mounting terminals on which it can be mounted. As a reference, this IC power includes SOT-23 functions for your convenience. Packages are specified to have an average peak reflow temperature of 225. The power management is mounted by a Surface Mount-axis. The power management system can be categorized as a Power Management Circuits chip. Pin count of the power management is 6. I should note that the minimum supply voltage (Vsup) for this IC management should be at least 800mV, which is the minimum supply voltage that should be applied. There should be no more than 5.5V volts of maximum supply voltage (Vsup) in this power management. To operate this power management, you will need at least 1/5V volts of power.

MAX6732AUTVDD3+ Features


Minimum supply voltage of 800mV


MAX6732AUTVDD3+ Applications


There are a lot of Maxim Integrated
MAX6732AUTVDD3+ Voltage Supervisors applications.


  • Display equipment
  • DC stabilized power supply module
  • Insulation fault location system
  • Magnetic resonance imaging
  • Stable power system
  • Sensitive sensors
  • Efficient information transmission
  • Functional modules
  • Consumer electronics
  • Personal computers

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