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MAX5803AUB+T

MAX5803AUB+T

MAX5803AUB+T

Maxim Integrated

DAC Voltage - Buffered Surface Mount R-2R R 1 B B

SOT-23

MAX5803AUB+T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Surface MountYES
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2014
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 10
Subcategory Other Converters
Technology BICMOS
Terminal Position DUAL
Terminal FormGULL WING
Number of Functions 1
Terminal Pitch0.5mm
Output Type Voltage - Buffered
Power Supplies2/53/5V
Number of Bits 8
Architecture R-2R
Converter Type D/A CONVERTER
Reference TypeExternal, Internal
Data InterfaceI2C
Differential OutputNo
Resolution 1 B
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time2.8μs (Typ)
Integral Nonlinearity (INL) 0.25 LSB
Input Bit Code OFFSET BINARY
INL/DNL (LSB) ±0.05, ±0.05
Number of D/A Converters 1
RoHS StatusROHS3 Compliant
In-Stock:1211 items

MAX5803AUB+T Product Details

MAX5803AUB+T Overview


The package that contains this software is called 10-TFSOP, 10-MSOP (0.118, 3.00mm Width). Part of the Other Converters family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. It is recommended that the operating temperature be kept within the range -40°C~125°C while the machine is operating. It is designed to maximiTape & Reel (TR)e space efficiency by containing the FPGA model in Tape & Reel (TR). In total, it has a total of 10 terminations. In order for it to work, it requires a 2/53/5V power supply.

MAX5803AUB+T Features


10-TFSOP, 10-MSOP (0.118, 3.00mm Width) package


MAX5803AUB+T Applications


There are a lot of Maxim Integrated
MAX5803AUB+T Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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