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MAX508BCWP+T

MAX508BCWP+T

MAX508BCWP+T

Maxim Integrated

DAC Voltage 1.5 B B 7.5mm mm

SOT-23

MAX508BCWP+T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 20
PackagingTape & Reel (TR)
Published 1996
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 20
Terminal Finish Matte Tin (Sn)
Max Operating Temperature70°C
Min Operating Temperature 0°C
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 12V
Pin Count20
Output Type Voltage
Temperature GradeCOMMERCIAL
Interface Parallel
Max Supply Voltage15.75V
Min Supply Voltage11.4V
Number of Bits 12
Converter Type D/A CONVERTER
Supply Type Dual
Resolution 1.5 B
Settling Time5 μs
Linearity Error-Max (EL) 0.024%
Integral Nonlinearity (INL) 1 LSB
Input Bit Code BINARY, OFFSET BINARY
Number of Converters 1
Height Seated (Max) 2.65mm
Width 7.5mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4336 items

MAX508BCWP+T Product Details

MAX508BCWP+T Overview


There are two packages that contain it: SOIC package and X package. The supply voltage is 12V volts. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In total, it has 20 terminations on each end. In this case, there are 20 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. During its maximal operating temperature, this module reaches 70°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. This device has a pin count of 20 in it. A maximum supply voltage of 15.75V can be applied to this product. The minimal supply voltage required for it is 11.4V.

MAX508BCWP+T Features


SOIC package
20 pin count
20 pins


MAX508BCWP+T Applications


There are a lot of Maxim Integrated
MAX508BCWP+T Digital to Analog Converters (DAC) applications.


  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation

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