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TF779 PLAIN

TF779 PLAIN

TF779 PLAIN

LMB Heeger Inc.

CHASSIS ALUM UNPAINTED 5"L X 4"W

SOT-23

TF779 PLAIN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Material Metal, Aluminum
PackagingBulk
Series Tite-Fit
Size / Dimension 5.000Lx4.000W 127.00mmx101.60mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Color Unpainted
Design U Shaped Pieces
Container Type Chassis
Area (L x W) 20.0in2 (129cm2)
Height 3.000 76.20mm
Thickness 0.040 1.02mm
RoHS StatusRoHS Compliant
In-Stock:721 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.52000$11.52
10$10.95500$109.55

About TF779 PLAIN

The TF779 PLAIN from LMB Heeger Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CHASSIS ALUM UNPAINTED 5"L X 4"W.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TF779 PLAIN, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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