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0322025.MXP

0322025.MXP

0322025.MXP

Littelfuse Inc.

FUSE CERAMIC 25A 65VAC/VDC 3AB

SOT-23

0322025.MXP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Holder
Package / Case 3AB, 3AG, 1/4 x 1-1/4
Surface MountNO
Terminal Shape END CAP
Operating Temperature-55°C~125°C
PackagingBulk
Series 322
Size / Dimension 0.250Diax1.250L 6.35mmx31.75mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Clip
ECCN Code EAR99
Resistance 2.9mOhm
Voltage - Rated DC 65V
Reach Compliance Code unknown
Current Rating25A
Reference Standard CE; UL
Voltage - Rated AC 65V
Approval Agency CE, UL
Physical Dimension 6.35mm x 31.75mm
Response TimeFast Blow
Fuse Type Cartridge, Ceramic
Breaking Capacity @ Rated Voltage 200A AC 1kA DC
Melting I2t 325
DC Cold Resistance 0.0029Ohm
Circuit Protection Type ELECTRIC FUSE
Blow Characteristic VERY FAST
Fuse Size 3AB
Joule Integral-Nom 325 J
Fuse Current 25A
Trip Time or Delay 14400 s
Diameter 6.35mm
Body Height 31.75mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1097 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 0322025.MXP

The 0322025.MXP from Littelfuse Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FUSE CERAMIC 25A 65VAC/VDC 3AB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0322025.MXP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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