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0315.700MXP

0315.700MXP

0315.700MXP

Littelfuse Inc.

FUSE GLASS 700MA 250VAC 3AB 3AG

SOT-23

0315.700MXP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 3AB, 3AG, 1/4 x 1-1/4 (Axial)
Terminal Shape PIN WIRE
Housing Material Glass
Operating Temperature-55°C~125°C
PackagingBulk
Series 315
Size / Dimension 0.275Diax1.275L 6.99mmx32.39mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Axial
ECCN Code EAR99
Resistance 700mOhm
HTS Code8536.10.00.40
Voltage - Rated DC 250V
Reach Compliance Code unknown
Current Rating700mA
Reference Standard CE; CSA; UL
Voltage - Rated AC 250V
Approval Agency CE, CSA, UL
Physical Dimension 32.34mm x 6.98mm
Response TimeSlow Blow
Fuse Type Cartridge, Glass
Breaking Capacity @ Rated Voltage 35A
Melting I2t 5.9
DC Cold Resistance 0.7Ohm
Circuit Protection Type ELECTRIC FUSE
Blow Characteristic TIME LAG
Joule Integral-Nom 5 J
Diameter 6.99mm
Body Height 6.98mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:7124 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 0315.700MXP

The 0315.700MXP from Littelfuse Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FUSE GLASS 700MA 250VAC 3AB 3AG.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0315.700MXP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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