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0269.750V

0269.750V

0269.750V

Littelfuse Inc.

Fuse Micro Very Fast Acting 0.75A 125V Radial 5.97 X 7.37mm Bulk

SOT-23

0269.750V Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can, Vertical
Terminal Shape PIN WIRE
Operating Temperature-55°C~125°C
PackagingBulk
Series Micro™ 269
Size / Dimension 0.235Dia x 0.290 H 5.97mmx7.37mm
JESD-609 Code e4
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
ECCN Code EAR99
Resistance 104mOhm
Terminal Finish GOLD
HTS Code8536.10.00.40
Voltage - Rated DC 125V
Reach Compliance Code unknown
Current Rating750mA
Reference Standard CSA; QPL; UL
Voltage - Rated AC 125V
Approval Agency CSA, QPL, UL
Response TimeFast Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 10kA
DC Cold Resistance 0.104Ohm
Circuit Protection Type ELECTRIC FUSE
Blow Characteristic VERY FAST
Height 7.366mm
RoHS StatusNon-RoHS Compliant
In-Stock:79 items

Pricing & Ordering

QuantityUnit PriceExt. Price
10$197.06400$1970.64

About 0269.750V

The 0269.750V from Littelfuse Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Fuse Micro Very Fast Acting 0.75A 125V Radial 5.97 X 7.37mm Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0269.750V, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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