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0224.750HXP

0224.750HXP

0224.750HXP

Littelfuse Inc.

FUSE GLASS 750MA 250VAC 125VDC

SOT-23

0224.750HXP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mount Clip, Through Hole
Mounting Type Through Hole
Package / Case 2AG, 5mm x 15mm (Axial)
Terminal Shape PIN WIRE
Body Material Glass
Operating Temperature-55°C~125°C
PackagingBulk
Series 224
Size / Dimension 0.185Diax0.570L 4.70mmx14.48mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Axial
ECCN Code EAR99
Resistance 152mOhm
Voltage - Rated DC 125V
Reach Compliance Code unknown
Current Rating750mA
Voltage - Rated AC 250V
Approval Agency CE, CSA, UL
Physical Dimension 4.8mm x 14.9mm
Response TimeFast Blow
Fuse Type Cartridge, Glass
Breaking Capacity @ Rated Voltage 35A AC 10kA DC
Melting I2t 1.05
DC Cold Resistance 0.152Ohm
Circuit Protection Type ELECTRIC FUSE
Fuse Size 2AG
Fuse Current 750mA
Trip Time or Delay 14400 s
Diameter 4.7mm
Body Height 14.9mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4395 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$1.43520$143.52

About 0224.750HXP

The 0224.750HXP from Littelfuse Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FUSE GLASS 750MA 250VAC 125VDC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0224.750HXP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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