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0208006.MXP

0208006.MXP

0208006.MXP

Littelfuse Inc.

FUSE GLASS 6A 350VAC 2AG

SOT-23

0208006.MXP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mounting Type Holder
Package / Case 2AG, 5mm x 15mm
Surface MountNO
Terminal Shape END CAP
Housing Material Glass
Operating Temperature-55°C~125°C
PackagingBulk
Series 208
Size / Dimension 0.185Diax0.570L 4.70mmx14.48mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Clip
ECCN Code EAR99
Resistance 15.4mOhm
Terminal Finish NICKEL
Reach Compliance Code unknown
Current Rating6A
Reference Standard CE; PSE; UL
Voltage - Rated AC 350V
Approval Agency CE, cURus, PSE
Body Length or Diameter 4.7mm
Physical Dimension 4.7mm x 14.48mm
Response TimeFast Blow
Fuse Type Cartridge, Glass
Breaking Capacity @ Rated Voltage 100A
Melting I2t 22.1
DC Cold Resistance 0.0154Ohm
Circuit Protection Type ELECTRIC FUSE
Joule Integral-Nom 22 J
Body Height 14.48mm
RoHS StatusROHS3 Compliant
In-Stock:24158 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.562000$0.562
10$0.530189$5.30189
100$0.500178$50.0178
500$0.471866$235.933
1000$0.445157$445.157

About 0208006.MXP

The 0208006.MXP from Littelfuse Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FUSE GLASS 6A 350VAC 2AG.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0208006.MXP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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