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LTC2634CMSE-LMX10#PBF

LTC2634CMSE-LMX10#PBF

LTC2634CMSE-LMX10#PBF

Linear Technology/Analog Devices

1.8mW μWDACVoltage - BufferedSurface Mount

SOT-23

LTC2634CMSE-LMX10#PBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Lifecycle Status PRODUCTION (Last Updated: 1 week ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
Operating Temperature0°C~70°C
PackagingTube
Published 2010
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Power Dissipation1.8mW
Base Part Number LTC2634
Pin Count10
Output Type Voltage - Buffered
Interface SPI, Serial
Number of Bits 10
Supply Type Single
Reference TypeExternal, Internal
Data InterfaceSPI
Differential OutputNo
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time3.8μs (Typ)
INL/DNL (LSB) ±0.2, ±0.5 (Max)
Number of D/A Converters 4
RoHS StatusROHS3 Compliant
In-Stock:1337 items

Pricing & Ordering

QuantityUnit PriceExt. Price
200$4.08800$817.6

LTC2634CMSE-LMX10#PBF Product Details

LTC2634CMSE-LMX10#PBF Overview


A 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad package is provided with this component. FPGA modules can be attached to development boards using a Surface Mount-connector. As far as the operating temperature is concerned, it should be kept within 0°C~70°C when operating. Using the Tube layout, this FPGA model can be contained in a very small amount of space. Parts related to this part can be found using its base part number LTC2634. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. As far as the pin count is concerned, it has 10 pins.

LTC2634CMSE-LMX10#PBF Features


10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad package
10 pin count

LTC2634CMSE-LMX10#PBF Applications


There are a lot of Linear Technology/Analog Devices LTC2634CMSE-LMX10#PBF Digital to Analog Converters (DAC)?applications.

  • Data Acquisition
  • General Purpose Trimming Adjustments
  • Display Electronics
  • Set Top Boxes
  • Direct Digital Waveform Generation
  • Instrumentation:
  • Automatic Test Equipment
  • Audio Amplifier
  • Bus Structured instruments
  • Waveform Reconstruction

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