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EPG.0B.303.HLNS

EPG.0B.303.HLNS

EPG.0B.303.HLNS

LEMO

Circular Push Pull Connectors ELBOW RECEPTACLE

SOT-23

EPG.0B.303.HLNS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Shell Material Brass and Polyphenylene Sulfide (PPS)
Insert Material Polyetheretherketone (PEEK)
Operating Temperature-55°C~250°C
PackagingBulk
Series 0B
Feature Board Lock
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 3
Color Brown, Silver
Fastening TypePush-Pull
Contact Finish - Mating Gold
Current Rating (Amps) 4.5A
Orientation G
Shielding Shielded
Ingress ProtectionIP50 - Dust Protected
Current Rating6A
Shell Finish Nickel
Shell Size - Insert 303
Contact Finish Thickness - Mating 59.0μin 1.50μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
Ratings IP50
In-Stock:246 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$39.07000$39.07
500$38.6793$19339.65
1000$38.2886$38288.6
1500$37.8979$56846.85
2000$37.5072$75014.4
2500$37.1165$92791.25

About EPG.0B.303.HLNS

The EPG.0B.303.HLNS from LEMO is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circular Push Pull Connectors ELBOW RECEPTACLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPG.0B.303.HLNS, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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