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TGF60-07870787-059

TGF60-07870787-059

TGF60-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

SOT-23

TGF60-07870787-059 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Aluminum Oxide filled Silicone
Shape Square
Series TGF60
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Shelf Life 24 Months
Outline 199.90mm x 199.90mm
Thermal Conductivity6.0W/m-K
Thermal Resistivity0.50°C/W
Thickness 0.0591 1.500mm
RoHS StatusROHS3 Compliant
In-Stock:138 items

Pricing & Ordering

QuantityUnit PriceExt. Price
20$60.54000$1210.8

About TGF60-07870787-059

The TGF60-07870787-059 from Leader Tech Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 199.9MMX199.9MM GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TGF60-07870787-059, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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