LFXP2-8E-5M132C Overview
Fpga chips is supplied in the 132-LFBGA, CSPBGA package. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. There are 86 I/Os for better data transfer. A fundamental building block contains 8000 logic elements or cells. Fpga chips is powered from a supply voltage of 1.2V. A Field Programmable Gate Arrays-series FPGA part. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 1.14V~1.26V . FPGAs belonging to the XP2 series are a type of FPGA that belong to the XP2 series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. In this device, there are 86 outputs that can be used. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is designed wFpga chipsh 132 terminations. Fpga electronics is worth mentioning that this device provides 226304 bfpga electronics s of RAM. You can find related parts by using the part number LFXP2-8, which is its base part number. The RAM si27.6kBe of this FPGA module reaches 27.6kB to ensure normal operation of the program. The device is designed with 132 pins in total. A total of 1000 LABs/CLBs make up this FPGA array. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Power is provided by a 1.21.2/3.33.3V battery that is included with the device. Fpga semiconductor is equipped wfpga semiconductorh 132 pin count. It usually uses a crystal oscillating at a frequency of 435MHz in order to do its work. Data and programs can be stored in this FPGA module's 29.9kB memory.
LFXP2-8E-5M132C Features
86 I/Os
Up to 226304 RAM bits
132 LABs/CLBs
LFXP2-8E-5M132C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-8E-5M132C FPGAs applications.
- Distributed Monetary Systems
- Development Boards and Shields for Microcontrollers
- Device controllers
- Solar Energy
- Automotive driver's assistance
- Broadcast
- Bioinformatics
- Automotive advanced driver assistance systems (ADAS)
- Artificial intelligence (AI)
- Embedded Vision
