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LCMXO3L-9400E-5BG256C

LCMXO3L-9400E-5BG256C

LCMXO3L-9400E-5BG256C

Lattice Semiconductor Corporation

FPGAs MachXO3 Series 256-LFBGA

SOT-23

LCMXO3L-9400E-5BG256C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LFBGA
Operating Temperature0°C~85°C TJ
PackagingTray
Series MachXO3
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 1.14V~1.26V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 206
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 9400
Total RAM Bits 442368
Number of LABs/CLBs 1175
RoHS StatusROHS3 Compliant
In-Stock:533 items

Pricing & Ordering

QuantityUnit PriceExt. Price
119$10.38580$1235.9102

LCMXO3L-9400E-5BG256C Product Details

LCMXO3L-9400E-5BG256C Overview


A 256-LFBGA package is provided with this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Its 206 I/Os help it transfer data more efficiently. To form a fundamental building block, there are 9400 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 1.14V~1.26V . As part of the MachXO3 series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. In order to save space, this FPGA model has been contained in Tray. A device like this one offers 442368 RAM bits, which is a considerable amount of memory. The FPGA consists of 1175 LABs/CLBs.

LCMXO3L-9400E-5BG256C Features


206 I/Os
Up to 442368 RAM bits

LCMXO3L-9400E-5BG256C Applications


There are a lot of Lattice Semiconductor Corporation LCMXO3L-9400E-5BG256C FPGAs applications.

  • Medical ultrasounds
  • Military Temperature
  • Device controllers
  • Digital signal processing
  • Data Center
  • ASIC prototyping
  • Data Mining
  • Industrial Ethernet
  • Ecosystem
  • Wireless Communications

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