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LCMXO2-4000HC-6QN84I

LCMXO2-4000HC-6QN84I

LCMXO2-4000HC-6QN84I

Lattice Semiconductor Corporation

FPGAs MachXO2 Series 84-VFQFN Dual Rows, Exposed Pad

SOT-23

LCMXO2-4000HC-6QN84I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 84-VFQFN Dual Rows, Exposed Pad
Operating Temperature-40°C~100°C TJ
PackagingTray
Published 2016
Series MachXO2
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
HTS Code8542.39.00.01
Voltage - Supply 2.375V~3.465V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 68
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4320
Total RAM Bits 94208
Number of LABs/CLBs 540
RoHS StatusROHS3 Compliant
In-Stock:422 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.63000$12.63
25$12.17160$304.29

LCMXO2-4000HC-6QN84I Product Details

LCMXO2-4000HC-6QN84I Overview


In the package 84-VFQFN Dual Rows, Exposed Pad, this product is provided. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. A total of 68 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 4320 logic elements or cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 2.375V~3.465V, this device operates with ease. It is a type of FPGA that belongs to the MachXO2 series of FPGAs. The operating temperature should be kept at -40°C~100°C TJ when operating. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 94208 bFpga chipss. The FPGA consists of 540 LABs/CLBs.

LCMXO2-4000HC-6QN84I Features


68 I/Os
Up to 94208 RAM bits

LCMXO2-4000HC-6QN84I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO2-4000HC-6QN84I FPGAs applications.

  • DO-254
  • OpenCL
  • Integrating multiple SPLDs
  • Solar Energy
  • Data center hardware accelerators
  • Image processing
  • Software-defined radio
  • Military Temperature
  • Artificial intelligence (AI)
  • Scientific Instruments

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