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LAE5UM-25F-6BG381E

LAE5UM-25F-6BG381E

LAE5UM-25F-6BG381E

Lattice Semiconductor Corporation

FPGAs LA-ECP5 Series 381-FBGA

SOT-23

LAE5UM-25F-6BG381E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 381-FBGA
Operating Temperature-40°C~125°C TJ
PackagingTray
Series LA-ECP5
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
HTS Code8542.39.00.01
Voltage - Supply 1.04V~1.155V
Number of I/O 197
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24000
Total RAM Bits 1032192
Number of LABs/CLBs 3000
RoHS StatusROHS3 Compliant
In-Stock:369 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$16.97000$16.97
25$14.89760$372.44
100$14.31170$1431.17

LAE5UM-25F-6BG381E Product Details

LAE5UM-25F-6BG381E Overview


There is a 381-FBGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 197 I/Os are programmed to ensure a more coherent data transfer. There are 24000 logic elements/cells to form a fundamental building block. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates wFpga chipsh a supply voltage of 1.04V~1.155V. It is a type of FPGA that belongs to the LA-ECP5 series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~125°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. The RAM bits that are offered by this fpga chips are 1032192. A total of 3000 LABs/CLBs make up this FPGA array.

LAE5UM-25F-6BG381E Features


197 I/Os
Up to 1032192 RAM bits

LAE5UM-25F-6BG381E Applications


There are a lot of Lattice Semiconductor Corporation LAE5UM-25F-6BG381E FPGAs applications.

  • Digital signal processing
  • Enterprise networking
  • Data Mining
  • Integrating multiple SPLDs
  • ASIC prototyping
  • Scientific Instruments
  • Space Applications
  • Distributed Monetary Systems
  • Automotive advanced driver assistance systems (ADAS)
  • Industrial IoT

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