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601604CY

601604CY

601604CY

LAPP

601604CY datasheet pdf and Multiple Conductor Cables product details from LAPP stock available on our website

SOT-23

601604CY Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Cable
Insulation Material PVC
Conductor MaterialCopper, Bare
Jacket (Insulation) Material Thermoplastic Polymer
Shield Material Copper, Tinned
PackagingDigi-Spool™, Continuous Spool
Series ÖLFLEX®
Published 2005
Feature Oil Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Color Grey
Voltage - Rated DC 600V
Number of Conductors 4
Wire Gauge16 AWG
Cable TypeMulti-Conductor
Wire/Cable Gauge 16 AWG
Jacket Color Gray
Conductor Strand30/0.0102
Usage Industrial
Jacket (Insulation) Diameter 0.421 (10.69mm)
Conductor Insulation Poly-Vinyl Chloride (PVC)
Shield Type Braid
Shield Coverage 85%
Length Enter Number of Feet in Order Quantity
RoHS StatusRoHS Compliant
In-Stock:1628 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.93000$3.93
500$3.8907$1945.35
1000$3.8514$3851.4
1500$3.8121$5718.15
2000$3.7728$7545.6
2500$3.7335$9333.75

About 601604CY

The 601604CY from LAPP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 601604CY datasheet pdf and Multiple Conductor Cables product details from LAPP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 601604CY, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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