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TMB1UT95RSMI17

TMB1UT95RSMI17

TMB1UT95RSMI17

LAIRDTECHNOLOGIESIAS

TMB1UT95RSMI17 datasheet pdf and Buzzer Elements, Piezo Benders product details from LAIRDTECHNOLOGIESIAS stock available on our website

SOT-23

TMB1UT95RSMI17 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 25 Weeks
Mount Surface Mount
Mounting Type Press Fit, Through Hole
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 8
Operating Temperature -40°C ~ 125°C
Packaging Bulk
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1
Number of Terminations 2
ECCN Code -
Temperature Coefficient -
Subcategory Operational Amplifier
Voltage - Supply 4V ~ 30V
Base Part Number Xxe Ulbe
Output Voltage 79 V
Output Type Analog Voltage
Interface I2C, SPI
Termination Type -
Operating Supply Current 10 mA
Nominal Supply Current 1 mA
Output Current 90 mA
Max Supply Current 10 mA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:2393 items

About TMB1UT95RSMI17

The TMB1UT95RSMI17 from LAIRDTECHNOLOGIESIAS is a high-performance microcontroller designed for a wide range of embedded applications. This component features TMB1UT95RSMI17 datasheet pdf and Buzzer Elements, Piezo Benders product details from LAIRDTECHNOLOGIESIAS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TMB1UT95RSMI17, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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