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A17916-09

A17916-09

A17916-09

Laird Technologies - Thermal Materials

A17916-09 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17916-09 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ B200
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity2.0W/m-K
Thickness 0.0900 2.286mm
In-Stock:478 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$15.43000$15.43
500$15.2757$7637.85
1000$15.1214$15121.4
1500$14.9671$22450.65
2000$14.8128$29625.6
2500$14.6585$36646.25

About A17916-09

The A17916-09 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17916-09 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17916-09, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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