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A17916-05

A17916-05

A17916-05

Laird Technologies - Thermal Materials

TFLEX B250 9X9IN

SOT-23

A17916-05 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ B200
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity2.0W/m-K
Thickness 0.0500 1.270mm
In-Stock:818 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$8.840145$8.840145
10$8.339760$83.3976
100$7.867698$786.7698
500$7.422356$3711.178
1000$7.002223$7002.223

About A17916-05

The A17916-05 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features TFLEX B250 9X9IN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17916-05, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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