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A17883-19

A17883-19

A17883-19

Laird Technologies - Thermal Materials

TFLEX HD84750 9" X 9"

SOT-23

A17883-19 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD80000
Part StatusActive
Moisture Sensitivity Level (MSL) Vendor Undefined
Type Gap Filler Pad, Sheet
Color Teal
Shelf Life 24 Months
Storage/Refrigeration Temperature 32°F~95°F 0°C~35°C
Shelf Life Start Date of Manufacture
Backing, Carrier Liner
Outline 228.60mm x 228.60mm
Thermal Conductivity6.0W/m-K
Thickness 0.190 4.83mm
RoHS StatusRoHS Compliant
In-Stock:55 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$305.64000$305.64
500$302.5836$151291.8
1000$299.5272$299527.2
1500$296.4708$444706.2
2000$293.4144$586828.8
2500$290.358$725895

About A17883-19

The A17883-19 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features TFLEX HD84750 9" X 9".

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17883-19, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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