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A17752-18

A17752-18

A17752-18

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM GRAY

SOT-23

A17752-18 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
Published 2018
Series Tflex™ HD90000
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity7.5W/m-K
Thickness 0.180 4.57mm
RoHS StatusRoHS Compliant
In-Stock:57 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$477.450000$477.45
10$450.424528$4504.24528
100$424.928800$42492.88
500$400.876227$200438.1135
1000$378.185120$378185.12

About A17752-18

The A17752-18 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17752-18, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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