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A17751-04

A17751-04

A17751-04

Laird Technologies - Thermal Materials

THERM PAD 457.2MMX457.2MM GRAY

SOT-23

A17751-04 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
Published 2018
Series Tflex™ HD90000
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 457.20mm x 457.20mm
Thermal Conductivity7.5W/m-K
Thickness 0.0400 1.016mm
RoHS StatusRoHS Compliant
In-Stock:43 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$427.92000$427.92
10$401.83200$4018.32
25$375.73880$9393.47

About A17751-04

The A17751-04 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 457.2MMX457.2MM GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17751-04, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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