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A17690-06

A17690-06

A17690-06

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM PINK

SOT-23

A17690-06 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Published 2018
Series Tflex™ HD700
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - One Side
Outline 228.60mm x 228.60mm
Thermal Conductivity5.0W/m-K
Thickness 0.0600 1.524mm
RoHS StatusRoHS Compliant
In-Stock:153 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$58.620218$58.620218
10$55.302092$553.02092
100$52.171785$5217.1785
500$49.218666$24609.333
1000$46.432703$46432.703

About A17690-06

The A17690-06 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM PINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17690-06, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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