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A17682-008

A17682-008

A17682-008

Laird Technologies - Thermal Materials

A17682-008 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17682-008 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ UT20000
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Outline 228.60mm x 228.60mm
Thermal Conductivity3.0W/m-K
Thickness 0.0080 0.203mm
RoHS StatusRoHS Compliant
In-Stock:578 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$13.353652$13.353652
10$12.597784$125.97784
100$11.884703$1188.4703
500$11.211983$5605.9915
1000$10.577343$10577.343

About A17682-008

The A17682-008 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17682-008 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17682-008, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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