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A17669-014

A17669-014

A17669-014

Laird Technologies - Thermal Materials

A17669-014 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17669-014 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ UT20000
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Outline 457.20mm x 457.20mm
Thermal Conductivity3.0W/m-K
Thickness 0.0140 0.356mm
RoHS StatusRoHS Compliant
In-Stock:132 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$73.41000$73.41
10$68.82000$688.2
25$64.23200$1605.8
50$61.93800$3096.9
100$59.64400$5964.4

About A17669-014

The A17669-014 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17669-014 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17669-014, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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