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A17653-14

A17653-14

A17653-14

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM PINK

SOT-23

A17653-14 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Published 2018
Series Tflex™ HD700
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity5.0W/m-K
Thickness 0.140 3.56mm
RoHS StatusRoHS Compliant
In-Stock:91 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$214.02000$214.02
10$200.97000$2009.7
25$187.92000$4698
50$184.65760$9232.88

About A17653-14

The A17653-14 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM PINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17653-14, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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