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A17653-09

A17653-09

A17653-09

Laird Technologies - Thermal Materials

A17653-09 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17653-09 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Published 2018
Series Tflex™ HD700
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity5.0W/m-K
Thickness 0.0900 2.286mm
RoHS StatusRoHS Compliant
In-Stock:124 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$102.095223$102.095223
10$96.316248$963.16248
100$90.864385$9086.4385
500$85.721118$42860.559
1000$80.868980$80868.98

About A17653-09

The A17653-09 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17653-09 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17653-09, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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