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A17157-02

A17157-02

A17157-02

Laird Technologies - Thermal Materials

A17157-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17157-02 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD300
Published 2018
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - One Side
Outline 457.20mm x 457.20mm
Thermal Conductivity2.7W/m-K
Thickness 0.0200 0.508mm
RoHS StatusRoHS Compliant
In-Stock:192 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$80.63000$80.63
10$75.99500$759.95
25$71.36200$1784.05
50$69.04500$3452.25
100$66.72800$6672.8

About A17157-02

The A17157-02 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17157-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17157-02, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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