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A16367-10

A16367-10

A16367-10

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM PINK

SOT-23

A16367-10 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Non-Silicone, Boron Nitride Filled
Shape Rectangular
Published 2012
Series Tflex™ SF600
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Outline 228.60mm x 228.60mm
Thermal Conductivity3.0W/m-K
Thickness 0.100 2.54mm
RoHS StatusRoHS Compliant
In-Stock:88 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$150.987425$150.987425
10$142.440967$1424.40967
100$134.378271$13437.8271
500$126.771954$63385.977
1000$119.596182$119596.182

About A16367-10

The A16367-10 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM PINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A16367-10, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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