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A16367-04

A16367-04

A16367-04

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX215.9MM PINK

SOT-23

A16367-04 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Non-Silicone, Boron Nitride Filled
Shape Rectangular
Published 2011
Series Tflex™ SF600 DF
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - One Side
Outline 228.60mm x 215.90mm
Thermal Conductivity3.0W/m-K
Length 215.9mm
Width 228.6mm
Thickness 0.0400 1.016mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:144 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$68.090178$68.090178
10$64.236017$642.36017
100$60.600016$6060.0016
500$57.169826$28584.913
1000$53.933798$53933.798

About A16367-04

The A16367-04 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX215.9MM PINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A16367-04, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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