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A16367-02

A16367-02

A16367-02

Laird Technologies - Thermal Materials

A16367-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A16367-02 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Non-Silicone, Boron Nitride Filled
Shape Rectangular
Series Tflex™ SF600 DF
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - One Side
Outline 228.60mm x 215.90mm
Thermal Conductivity2.8W/m-K
Thickness 0.0200 0.508mm
RoHS StatusRoHS Compliant
In-Stock:180 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$45.999207$45.999207
10$43.395479$433.95479
100$40.939131$4093.9131
500$38.621822$19310.911
1000$36.435681$36435.681

About A16367-02

The A16367-02 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A16367-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A16367-02, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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