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A15959-20

A15959-20

A15959-20

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM GRAY

SOT-23

A15959-20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
Published 2008
Series Tflex™ HR400
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity1.8W/m-K
Width 229mm
Thickness 0.200 5.08mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
In-Stock:150 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$58.482485$58.482485
10$55.172156$551.72156
100$52.049204$5204.9204
500$49.103022$24551.511
1000$46.323606$46323.606

About A15959-20

The A15959-20 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A15959-20, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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