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A15896-04

A15896-04

A15896-04

Laird Technologies - Thermal Materials

THERM PAD 228.6MMX228.6MM GRAY

SOT-23

A15896-04 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone
Shape Square
PackagingBulk
Published 2008
Series Tflex™ 700
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Resistance 100GOhm
Max Operating Temperature200°C
Min Operating Temperature -45°C
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity5.0W/m-K
Length 229mm
Width 229mm
Thickness 0.0400 1.016mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:100 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$98.131445$98.131445
10$92.576835$925.76835
100$87.336637$8733.6637
500$82.393053$41196.5265
1000$77.729295$77729.295

About A15896-04

The A15896-04 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 228.6MMX228.6MM GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A15896-04, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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