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A15796-28

A15796-28

A15796-28

Laird Technologies - Thermal Materials

A15796-28 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A15796-28 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone
Shape Square
Series Tflex™ 700
Published 2008
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Resistance 100GOhm
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity5.0W/m-K
Width 229mm
Thickness 0.200 5.08mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
In-Stock:52 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$354.677579$354.677579
10$334.601490$3346.0149
100$315.661783$31566.1783
500$297.794135$148897.0675
1000$280.937863$280937.863

About A15796-28

The A15796-28 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A15796-28 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A15796-28, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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