Welcome to Hotenda.com Online Store!

logo
userjoin
Home

A14559-02

A14559-02

A14559-02

Laird Technologies - Thermal Materials

Thermal Interface Products Tflex 550 18x18" 2.8W/mK gap filler

SOT-23

A14559-02 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
PackagingBulk
Published 2010
Series Tflex™ 500
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Max Operating Temperature200°C
Min Operating Temperature -50°C
Color Blue
Adhesive Tacky - Both Sides
Outline 457.20mm x 457.20mm
Thermal Conductivity2.8W/m-K
Thickness 0.0500 1.270mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:79 items

Pricing & Ordering

QuantityUnit PriceExt. Price
2$208.74000$417.48

About A14559-02

The A14559-02 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features Thermal Interface Products Tflex 550 18x18" 2.8W/mK gap filler.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A14559-02, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News