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A14556-01

A14556-01

A14556-01

Laird Technologies - Thermal Materials

A14556-01 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A14556-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
PackagingBulk
Series Tflex™ 500
Published 2010
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Max Operating Temperature200°C
Min Operating Temperature -45°C
Color Blue
Breakdown Voltage7.4kV
Adhesive Tacky - Both Sides
Backing, Carrier Fiberglass
Outline 228.60mm x 228.60mm
Thermal Conductivity2.8W/m-K
Thickness 0.0200 0.508mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:349 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$29.48000$29.48
10$27.74400$277.44
25$26.01000$650.25
50$24.27600$1213.8
100$23.40900$2340.9
250$22.10852$5527.13

About A14556-01

The A14556-01 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A14556-01 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A14556-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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