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67SLH080080080PI00

67SLH080080080PI00

67SLH080080080PI00

Laird Technologies EMI

Film Over Foam 0.315 8.00mm 0.315 8.00mm 0.315 8.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 8.001mm Hourglass -40°C~70°C

SOT-23

67SLH080080080PI00 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature-40°C~70°C
PackagingTape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.315 8.00mm
Length 0.315 8.00mm
Width 0.315 8.00mm
Thickness 8.001mm
RoHS StatusRoHS Compliant
In-Stock:12585 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$0.42780$213.9

67SLH080080080PI00 Product Details

67SLH080080080PI00 Overview


Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.

67SLH080080080PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLH080080080PI00 Applications


There are a lot of Laird Technologies EMI
67SLH080080080PI00 RFI and EMI Contacts applications.


  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger
  • LED Lighting

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