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67SLG050060050PI00

67SLG050060050PI00

67SLG050060050PI00

Laird Technologies EMI

Film Over Foam 0.197 5.00mm 0.197 5.00mm 0.236 6.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.9944mm Rectangle -40°C~70°C

SOT-23

67SLG050060050PI00 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature-40°C~70°C
PackagingTape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.236 6.00mm
Length 0.197 5.00mm
Width 0.197 5.00mm
Thickness 5.9944mm
RoHS StatusRoHS Compliant
In-Stock:2470 items

Pricing & Ordering

QuantityUnit PriceExt. Price
850$0.24253$206.1505

67SLG050060050PI00 Product Details

67SLG050060050PI00 Overview


The Contact RFI contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI is capable of working normally at -40°C~70°C.High reliability is provided by the advanced RFI and EMI contact' packaging Tape & Reel (TR).The contacter RFI temperature should not exceed 158°C degrees Celsius.Film Over Foam RF Type from the contacter RFI.The RFI EMI is a kind of the well-known SMD Grounding Metallized series of products.

67SLG050060050PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLG050060050PI00 Applications


There are a lot of Laird Technologies EMI
67SLG050060050PI00 RFI and EMI Contacts applications.


  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness

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