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67SLG040035030PI00

67SLG040035030PI00

67SLG040035030PI00

Laird Technologies EMI

Film Over Foam 0.157 4.00mm 0.118 3.00mm 0.138 3.50mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 3.5052mm Rectangle -40°C~70°C

SOT-23

67SLG040035030PI00 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature-40°C~70°C
PackagingTape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.138 3.50mm
Length 0.118 3.00mm
Width 0.157 4.00mm
Thickness 3.5052mm
RoHS StatusRoHS Compliant
In-Stock:14152 items

Pricing & Ordering

QuantityUnit PriceExt. Price

67SLG040035030PI00 Product Details

67SLG040035030PI00 Overview


Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are used in Contact RFI packaging.-40°C~70°C is the operating temperature and EMI/RFI works fine.In order to provide high reliability, advanced RFI and EMI contact' packaging Tape & Reel (TR) is used.There should be 158°C more than 158°C degrees Celsius in the contacter RFI.The contacter RFI type is Film Over Foam.A RFI EMI from the well-known SMD Grounding Metallized series of products is being offered here.

67SLG040035030PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLG040035030PI00 Applications


There are a lot of Laird Technologies EMI
67SLG040035030PI00 RFI and EMI Contacts applications.


  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger
  • LED Lighting
  • Utility Energy

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