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0078001817

0078001817

0078001817

Laird Technologies EMI

Fingerstock 0.320 8.13mm 0.543 13.79mm 0.110 2.79mm Ultrasoft Slot Mount Beryllium Copper 2.794mm 121°C Tin

SOT-23

0078001817 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Beryllium Copper
Operating Temperature121°C
Series Ultrasoft Slot Mount
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Plating Tin
Attachment Method Slot
Height 0.110 2.79mm
Length 0.543 13.79mm
Width 0.320 8.13mm
Plating Thickness 299.21μin 7.60μm
Thickness 2.794mm
RoHS StatusRoHS Compliant
In-Stock:14385 items

Pricing & Ordering

QuantityUnit PriceExt. Price

0078001817 Product Details

0078001817 Overview


Contact RFI is packaged with the materials of Beryllium Copper.The EMI/RFI has the capability of operating at a temperature of 121°C.Fingerstock Type from the contacter RFI.It is one of the well-known Ultrasoft Slot Mount series RFI EMI line.

0078001817 Features


Fingerstock
Ultrasoft Slot Mount series


0078001817 Applications


There are a lot of Laird Technologies EMI
0078001817 RFI and EMI Contacts applications.


  • Transmit
  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security

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