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0077008419

0077008419

0077008419

Laird Technologies EMI

Fingerstock 0.370 9.40mm 16.000 406.40mm 0.130 3.30mm No Snag Beryllium Copper 101.6μm 121°C Tin

SOT-23

0077008419 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Material Beryllium Copper
Operating Temperature121°C
Series No Snag
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Plating Tin
Attachment Method Adhesive
Height 0.130 3.30mm
Length 16.000 406.40mm
Width 0.370 9.40mm
Plating Thickness 299.21μin 7.60μm
Thickness 101.6μm
RoHS StatusRoHS Compliant
In-Stock:4580 items

0077008419 Product Details

0077008419 Overview


The Contact RFI contains materials from Beryllium Copper.The EMI/RFI is capable of working normally at 121°C.Fingerstock RF Type from the contacter RFI.The RFI EMI is a kind of the well-known No Snag series of products.

0077008419 Features


Fingerstock
No Snag series


0077008419 Applications


There are a lot of Laird Technologies EMI
0077008419 RFI and EMI Contacts applications.


  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness

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