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RKC8BD331J

RKC8BD331J

RKC8BD331J

KOA Speer Electronics, Inc.

Res Thick Film NET 330 Ohm 5% 1W ±200ppm/C BUS Conformal 9-Pin SIP Pin Thru-Hole Stick Pack

SOT-23

RKC8BD331J Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case SIP
Tolerance 5%
JESD-609 Code e1
Number of Terminations 9
Termination Pin
Temperature Coefficient-200200 ppm/°C
Resistance 330Ohm
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature155°C
Min Operating Temperature -55°C
Subcategory Array/Network Resistors
Power Rating 1W
Packing Method Bulk
Technology METAL GLAZE/THICK FILM
Terminal Pitch2.54mm
Depth 2.5mm
Construction Rectangular
Resistor Type ARRAY/NETWORK RESISTOR
Military Standard Not
Rated Power Dissipation (P) 0.125W
Working Voltage 200V
Number of Resistors 8
Network Type Bussed
Length 23.4mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2859 items

About RKC8BD331J

The RKC8BD331J from KOA Speer Electronics, Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thick Film NET 330 Ohm 5% 1W ±200ppm/C BUS Conformal 9-Pin SIP Pin Thru-Hole Stick Pack.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RKC8BD331J, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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