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KVR1066D3S8N7/2G

KVR1066D3S8N7/2G

KVR1066D3S8N7/2G

Kingston Technology

KVR1066D3S8N7/2G datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KVR1066D3S8N7/2G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 8
Chip Density (bit) 2G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1066
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks Single
Number of Chip Banks 8
CAS Latency 7
PC Type PC3-8500
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part StatusObsolete
Pin Count240
Organization 256Mx64
PLL No
Self Refresh No
Module Type 240DIMM
RoHS StatusSupplier Unconfirmed
In-Stock:2210 items

About KVR1066D3S8N7/2G

The KVR1066D3S8N7/2G from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features KVR1066D3S8N7/2G datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the KVR1066D3S8N7/2G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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