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KSM26SED8/16ME

KSM26SED8/16ME

KSM26SED8/16ME

Kingston Technology

KSM26SED8/16ME datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KSM26SED8/16ME Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1629
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks Dual
CAS Latency 17
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Part StatusObsolete
Pin Count260
Organization 2Gx72
Module Type 260SODIMM
RoHS StatusRoHS Compliant
In-Stock:1679 items

About KSM26SED8/16ME

The KSM26SED8/16ME from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features KSM26SED8/16ME datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the KSM26SED8/16ME, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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