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KSM26RD8/32MEI

KSM26RD8/32MEI

KSM26RD8/32MEI

Kingston Technology

KSM26RD8/32MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KSM26RD8/32MEI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
PCB changed 288
Package Length 133.35
Package Height 31.25
Mounting Socket
Supplier Package RDIMM
SPD EEPROM Support No
CAS Latency 19
Number of Ranks Dual
ECC Support Yes
Module Sides Double
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) 0
Operating Current (mA) 1656
Typical Operating Supply Voltage (V) 1.2
Chip Package Type FBGA
Chip Configuration 2Gx8
Maximum Clock Rate (MHz) 2666
Data Bus Width (bit) 72
Chip Density (bit) 16G
Number of Chip per Module 18
Module Density 32Gbyte
Module DRAM Module
HTS 8473.30.11.40
ECCN (US) 4A994.a
Part StatusActive
Pin Count288
Organization 4Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
RoHS StatusRoHS Compliant
In-Stock:3798 items

About KSM26RD8/32MEI

The KSM26RD8/32MEI from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features KSM26RD8/32MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the KSM26RD8/32MEI, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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